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Abstract
Governments,
customers and the public are increasingly interested in the proper
disposal or reuse of used electronics. Product donation, reuse and
recycling divert waste from landfills and can result in recovered
materials being recycled into other products.
As a competitive contract manufacturer in the world, Prosoyo's largest
impact on the environment is through our production lines.
Prosoyo is committed to providing products and services that are
environmentally sound throughout their life cycles.
Many countries are adopting or proposing legislation requiring responsible
end-of-life product management. In Europe, the Waste Electrical
and Electronic Equipment (WEEE) Directive requires manufacturers
to ensure that electronic products disposed of by customers in the
EU are recycled. The WEEE Directive is scheduled to be implemented
in 2005. Other regulations affecting the recycling and disposal
of electronic waste, or 'e-waste', are emerging globally, including
in the United States, Canada, Mexico, China, Taiwan and Korea. The
variety of legislative approaches presents a considerable challenge
for Prosoyo.
To successfully achieve lead-free electronics assembly, each participant
in the manufacturing process, from purchasing to engineering to
maintenance to Quality/Inspection, must have a solid understanding
of the changes required of them. This pertains to considerations
regarding design, components, PWBs, solder alloys, fluxes, printing,
reflow, wave soldering, rework, cleaning, equipment wear & tear
and inspection.
Introduction
With the WEEE and RoHS Directive in Europe potentially outlawing
lead from electronics produced and imported in the EU as early as
2006 and foreign
competition driving the implementation of lead-free electronics
assembly around the world, additional questions regarding how manufacturers
can successfully transition to lead-free assembly continue to arise.
A great deal of consortia work and empirical data exists on lead-free
soldering. What has been lacking, however, are studies directly
related to real-world applications and advice on such topics as
procurement, design, processes, maintenance, inspection, etc. This
paper shall address each step of the manufacturing cycle and discuss
the means to overcome the many challenges of lead-free assembly.
The transition to fully lead free manufacturing incurs two main
issues, the first of which are the problems caused by the use of
lead free components in
the electronic manufacturing environment, not least of which are
concerns about the reliability of tin lead plated components in
a lead free joint, however, the acceptance of lead free processes
is continuing to grow within the electronic industry.
The second, is the supply of lead free components. Component manufacturers
are demonstrating very different levels of commitment to lead free
manufacturing, and unfortunately, this can cause additional logistical
problems, for example, some component manufacturers do not intend
to change part numbers for lead free components, which may cause
difficulties in differentiating lead free and non lead free components.
Prosoyo is committed to addressing these issues by careful supply
chain management and close liaison with our component suppliers.
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